FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE SAME

摘要

A method of forming a focal plane array by: preparing a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer; preparing a second wafer including read-out integrated circuit and a contact pad, which is covered by another sacrificial layer into which are formed support legs in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; defining a pixel in the sensing material and forming a conductive via through the pixel for providing a connection between an uppermost surface of the pixel and the supporting legs; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.

主权项

1. A method of forming a focal plane array comprising one or more pixels, the focal plane array being fabricated by:
preparing a first wafer having sensing material provided on a surface, which is covered by a first sacrificial layer; preparing a second wafer including read-out integrated circuit (ROIC) and a contact pad, which is covered by a second sacrificial layer into which are formed one or more support legs in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; defining a pixel in the sensing material above each of the one or more support legs and forming a conductive via through each pixel defined for providing a connection between an uppermost surface of the pixel and its support legs; and removing the sacrificial layers to release the one or more pixel, each of the one or more pixels being defined such that its support legs are arranged to be completely beneath the sensing material of the pixel.