| 发明名称 |
Integrated Circuit Package and Methods of Forming Same |
| 摘要 |
An embodiment package-on-package (PoP) device includes a package structure, a package substrate, and a plurality of connectors bonding the package structure to the package substrate. The package structure includes a logic chip bonded to a memory chip, a molding compound encircling the memory chip, and a plurality of conductive studs extending through the molding compound. The plurality of conductive studs is attached to contact pads on the logic chip. |
| 申请公布号 |
US2015206865(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201414252232 |
申请日期 |
2014.04.14 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Yee Kuo-Chung;Lii Mirng-Ji;Lee Chien-Hsun;Wu Jiun Yi |
| 分类号 |
H01L25/18;H01L23/00;H01L23/31;H01L25/00;H01L21/56 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package-on-package (PoP) device comprising:
a first package structure comprising:
a logic chip bonded to a memory chip;a first molding compound encircling the memory chip; anda first plurality of conductive studs extending through the first molding compound and attached to contact pads on the logic chip; a first package substrate; and a first plurality of connectors bonding the first package structure to the first package substrate. |
| 地址 |
Hsin-Chu TW |
