LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

摘要

A fabrication method of a layer structure for mounting a semiconductor device is provided, which includes the steps of: providing a base material, wherein the base material has a conductive layer having a first surface having a plurality of first conductive elements and an opposite second surface having a plurality of second conductive elements, and a first encapsulant formed on the first surface of the conductive layer for encapsulating the first conductive elements; partially removing the conductive layer to form a circuit layer that electrically connects the first conductive elements and the second conductive elements; and forming a second encapsulant on a bottom surface of the first encapsulant for encapsulating the circuit layer and the second conductive elements, thus reducing the fabrication difficulty and increasing the product yield.

主权项

1. A layer structure for mounting a semiconductor device, comprising:
a first encapsulant having a first bottom surface and a first top surface opposite to the first bottom surface; a plurality of first conductive elements embedded in the first encapsulant and each having a first end portion exposed from the first bottom surface of the first encapsulant; a circuit layer formed on the first end portions of the first conductive elements and having a first surface adjacent to the first conductive elements and a second surface opposite to the first surface; a plurality of second conductive elements formed on the second surface of the circuit layer so as to be electrically connected to the first conductive elements through the circuit layer; and a second encapsulant formed on the first bottom surface of the first encapsulant for encapsulating the circuit layer and the second conductive elements, wherein the second encapsulant has a second top surface adjacent to the first encapsulant and a second bottom surface opposite to the second top surface.