CONNECTION BODY, CONNECTION BODY PRODUCTION METHOD, CONNECTION METHOD, ANISOTROPIC CONDUCTIVE ADHESIVE

摘要

The purpose of the invention is to ensure that there is conductivity between an electronic component and a circuit substrate when the wiring pitch of the circuit substrate or the electrode terminals of the electronic component are given a finer pitch and to prevent shorts from occurring between the electrode terminals of the electronic component. The invention provides a connection body (10) with an electronic component (18) disposed on a circuit substrate (12) via an anisotropic conductive adhesive (1), wherein the anisotropic conductive adhesive (1) has conductive particles (4) regularly disposed therein, the particle diameter of the conductive particles (4) being 1/2 the height of the connection electrodes (19) of the electronic component (18) or smaller.