| 摘要 |
In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources. |
