| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor, a resin compact for an optical semiconductor and a method of manufacturing the same, an optical semiconductor package, and an optical semiconductor device, capable of preventing generation of defects, such as cracks, breakage, peeling-off, on a resin layer around a unit mounting region when a resin compact for an optical semiconductor is removed from a molding die.SOLUTION: In a lead frame 1 for an optical semiconductor, a plurality of unit mounting regions 10 each consisting of two or more lead parts 20 and 21 separated from each other are provided consecutively lengthwise and crosswise. A frame body 12 is provided around an aggregate 11 of the plurality of unit mounting regions 10, with a clearance 25. A unit mounting region 10x arranged at a peripheral end of the aggregate 11, and the frame body 12 are coupled with each other, and a supporting part 13 supporting the aggregate 11 is provided inside the frame body 12. The frame body 12 is provided with a notch groove 14 for resin injection that opens toward an inside end surface 26 facing on the clearance 25. |
