| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-curable adhesive composition.SOLUTION: The heat-curable adhesive composition comprises the following (1) to (3): (1) 20-85% by weight of a polyether (A) of the following formula (1), comprising two terminal groups of hydrolyzable alkoxysilane type, having a viscosity measured at 23°C of 25-40 Pa s: Formula (1) (where Rand Reach represent a linear or branched alkyl radical having 1 to 4 carbon atoms; Rrepresents a divalent linear alkylene radical having 1 to 6 carbon atoms; Rrepresents a divalent linear or branched alkylene radical having 1 to 4 carbon atoms; n is an integer allowing the number-average molecular weight Mn of the polymer of formula (I) to be between 20 kDa and 40 kDa; p is an integer equal to 0, 1, or 2); (2) 15-80% by weight of a compatible tackifying resin (B) having number average molecular weight of 200 Da-10 kDa; and (3) 0.01-3% by weight of a crosslinking catalyst (C). |
