| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which such a pattern film can be formed that maintains a high development residual film rate while having no development residue in the forming process of the pattern film, has excellent heat resistance in high-temperature baking, and has excellent low dielectric characteristics.SOLUTION: The photosensitive resin composition comprises: an indene copolymer component containing a structural unit derived from indene, a structural unit derived from an acid anhydride, and a structural unit derived by esterification of an acid anhydride monomer with alcohol; a photosensitive agent component having a quinone diazide group; and a compound component having an epoxy group. |
