WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and a manufacturing method thereof capable of filling a through hole with a conductive material in a short time while preventing formation of voids.SOLUTION: A base conductive layer 4 is formed from a peripheral region of a through hole 3 to inner wall 3a within a through hole 3. With this, when a conductive material 5 is formed by means of electrolytic plating, a central part is closed first. Thus, the through hole 3 is filled with the conductive material in a short time while preventing formation of voids.