Method Of Manufacturing Semiconductor Device And The Semiconductor Device

摘要

A lead frame having a first chip-mounting part on which a first semiconductor chip is mounted and having a second chip-mounting part on which a second semiconductor chip is mounted is prepared. Moreover, a process is provided, the process connecting a first electrode pad, which is formed on a top surface of the first semiconductor chip, with a first end of a first metal ribbon and connecting a ribbon-connecting surface on the second chip-mounting part with a second end of the first metal ribbon on the opposite side of the first end. Moreover, in a plan view, the ribbon-connecting surface of the second chip-mounting part is positioned between the first semiconductor chip and the second semiconductor chip. Moreover, the height of the ribbon-connecting surface is positioned at a position higher than the height of a mounting surface of the second semiconductor chip of the second chip-mounting part.

主权项

1. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a lead frame having a first chip-mounting part on which a first semiconductor chip is mounted and a second chip-mounting part on which a second semiconductor chip is mounted; (b) electrically connecting a first electrode pad formed on a top surface of the first semiconductor chip with a first end of a first metal ribbon by applying ultrasonic waves to a first bonding tool; and (c) electrically connecting a ribbon-connecting surface of a ribbon-connecting part of the second chip-mounting part with a second end of the first metal ribbon on the opposite side of the first end by applying ultrasonic waves to the first bonding tool, wherein, in a plan view, the ribbon-connecting surface of the second chip-mounting part is positioned between the first semiconductor chip and the second semiconductor chip; and the height of the ribbon-connecting surface is positioned at a position higher than the height of a chip-connecting surface of a chip-connecting part of the second chip-mounting part on which the second semiconductor chip is mounted.