PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR PROCESSING ELECTRONIC COMPONENT/GLASS SUBSTRATE, PRESSURE-SENSITIVE ADHESIVE TAPE FOR PROCESSING ELECTRONIC COMPONENT/GLASS SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT/GLASS SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition for processing an electronic component/glass substrate that is used for protecting the electronic component/glass substrate in the manufacture of the electronic component/glass substrate in which at least a chemical cleaning step is performed, can easily be peeled off while having a high adhesive force and is excellent in chemical resistance, to provide a pressure-sensitive adhesive tape for processing an electronic component/glass substrate that uses the pressure-sensitive adhesive composition and to provide a method for manufacturing an electronic component/glass substrate.SOLUTION: The pressure-sensitive adhesive composition for processing an electronic component/glass substrate is used for protecting the electronic component/glass substrate in the manufacture of the electronic component/glass substrate in which at least a chemical cleaning step is performed, and comprises: a crosslinkable resin having a molecular weight distribution (Mw/Mn) of 1.05 to 2.50, which is produced by subjecting a monomer mixture containing a monomer having a functional group acting as a crosslinking point to living radical polymerization; and a crosslinking agent.