发明名称 |
PINCETTE TYPE SOLDERING IRON |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pincette type soldering iron capable of performing a pincette setting work efficiently according to the shape and size of an electronic part.SOLUTION: A pincette type soldering iron 1 for mounting and de-mounting electronic parts by melting a solder, is characterized by comprising: a pair of pincettes 10 and 20 for gripping the electronic parts; a rolling mechanism 50 for supporting the individual pincettes 10 and 20 turnably; and an angle adjustment mechanism 51 provided on said rolling mechanism 50 for setting the opening width of the leading ends of said pincettes 10 and 20 selectively.</p> |
申请公布号 |
JP2015131316(A) |
申请公布日期 |
2015.07.23 |
申请号 |
JP20140003688 |
申请日期 |
2014.01.10 |
申请人 |
TAIYO DENKI SANGYO KK |
发明人 |
YAMANA KAZUYA;FUKUYAMA IKUKO;KATAOKA EIICHIRO |
分类号 |
B23K3/04;B23K3/02;H05K3/34 |
主分类号 |
B23K3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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