发明名称 |
SEMICONDUCTOR MODULE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an art to easily manufacture a semiconductor module having a liquid-cooled cooler while preventing adhesion of a resin on fin surfaces.SOLUTION: A manufacturing method of a semiconductor module 1 comprises a process of molding a mold resin 50 in a state where a cover 46 surrounds fins 44. |
申请公布号 |
JP2015133402(A) |
申请公布日期 |
2015.07.23 |
申请号 |
JP20140004021 |
申请日期 |
2014.01.14 |
申请人 |
TOYOTA MOTOR CORP |
发明人 |
ORIMOTO NORIMUNE;IDE YUKI |
分类号 |
H01L23/473;H01L21/56;H01L23/34 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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