POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing device which can reduce pressure fluctuation in a pressure chamber of a top ring and stabilize a pressure in the pressure chamber.SOLUTION: A polishing device includes: a rotatable top ring 30 having a pressure chamber C1 for pressing a substrate W to a polishing pad 23; a pressure regulator R1 which regulates a pressure of a gas in the pressure chamber C1; a gas transfer line F1 which connects the pressure regulator R1 with the pressure chamber C1; a flow meter G1 which measures a flow rate of the gas flowing in the gas transfer line F1; and a buffer tank T1 communicating with the gas transfer line F1. The buffer tank T1 is disposed between the pressure regulator R1 and the flow meter G1.