| 发明名称 |
CERAMIC CIRCUIT BOARD OF LASER PLATE COPPER AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A ceramic circuit board of laser plate copper and manufacturing method thereof is provided. The method includes: providing a ceramic substrate; laser engraving, on a surface of the ceramic substrate, so as to form a circuit pattern of a plurality of groove structures; roughening and activating, on the surface of the ceramic substrate, by washing the surface of the ceramic substrate with a roughening and activating solution; and plating a metal layer, on the groove structures, so as to form a conductive loop defined by the circuit pattern. |
| 申请公布号 |
US2015208499(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201514600012 |
申请日期 |
2015.01.20 |
| 申请人 |
Rhema Technology & Trading Company Limited |
发明人 |
Wu Ku Chou |
| 分类号 |
H05K1/03;H05K1/09;H05K1/02;H05K3/10 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of a ceramic circuit board of laser plate copper, comprising:
providing a ceramic substrate; laser engraving, on a surface of the ceramic substrate, so as to form a circuit pattern of a plurality of groove structures; roughening and activating, on the surface of the ceramic substrate, by washing the surface of the ceramic substrate with a roughening and activating solution; and plating a metal layer, on the groove structures, so as to form a conductive loop defined by the circuit pattern. |
| 地址 |
Seri Begawan BN |
