| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation performance of a built-in electronic component.SOLUTION: A core substrate 21 of a wiring board 11 has a cavity 22 which penetrates between an upper surface 21a and a lower surface 21b. The cavity 22 includes: first cavities 22a, each of which has a conductive film 23 formed on an inner surface, and a second cavity 22b which allows the first cavities 22a to communicate with each other. A chip capacitor 31 is disposed in the cavity 22. The first cavities 22a are filled with a conductive material 32. The conductive material 32 is disposed between a connection terminal 31b of the chip capacitor 31 and the conductive film 23 and electrically connects the connection terminal 31b with the conductive film 23. The connection terminal 31b of the chip capacitor 31 is connected with wiring layers 26, 27 (wiring 26a, 26b, 27a, 27b) of the core substrate 21 by the conductive material 32. The wiring layers 26, 27 are connected with a substrate 100 through a wiring layer 52, conductive materials such as vias 53 etc., and a connection terminal 72. |
