| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface-treated copper powder that has an excellent sintering delay property, and a production method therefor.SOLUTION: Provided is a surface-treated copper powder obtained by providing a surface-treated layer that comprises element selected from Al, Si, Ti, Zr, Ce and Sn, on the surface of a copper powder and in which x (nm), the thickness of the surface-treated layer comprising element selected from Al, Si, Ti, Zr, Ce and Sn, in a concentration profile of EDS near the surface obtained by STEM, and y (°C), the sintering initiation temperature of copper powder, satisfy equations: 0.3≤x≤10 and 25x+610≤y; and also provided is a method for producing surface-treated copper powder, comprising: a step of obtaining an alkaline-treated copper powder by mixing a copper powder with an alkaline aqueous solution and followed by separation; and a step of obtaining a surface-adhesion reagent-treated copper powder by mixing an alkaline-treated copper powder with a surface-adhesion reagent solution comprising elements selected from Al, Si, Ti, Zr, Ce and Sn, and followed by separation.</p> |
