SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

This semiconductor device is provided with: a semiconductor element (12) that comprises a solder region (12a1) and a non-solder region (12a2) on one surface; a first metal member (22) that is arranged on the one surface side of the semiconductor element; a second metal member (18) that is arranged on the back surface side of the semiconductor element; a first solder (20) that connects the solder region of the semiconductor element and the first metal member with each other; and a second solder (16) that connects the back surface of the semiconductor element and the second metal member with each other. At least the second solder provides melt bonding. In a projection view from the lamination direction, the position of the center of gravity (Cg) of the first metal member coincides with the position of the center (C1) of the semiconductor element.