| 摘要 |
<p>In a substrate processing device (1), multiple large chamber discharge ports (281) arranged in the circumferential direction are provided to a chamber bottom part (256). A cup discharge port (461) selectively overlaps with one of the large chamber discharge ports (281) as a consequence of a cup part (4) being rotated by means of a cup rotating mechanism (7). The gaseous body within the cup part (4) is discharged to the outside of a chamber (21) by means of a first discharge mechanism (95a) when the cup discharge port (461) overlaps with one of the large chamber discharge ports (281). Meanwhile, the gaseous body within the cup part (4) is discharged to the outside of the chamber (21) by means of a second discharge mechanism (95b) when the cup discharge port (461) overlaps with another large chamber discharge port (281). In said substrate processing device (1), it is possible to easily switch discharge mechanisms, with which the gaseous body within the cup part (4) is discharged, by rotating the cup part (4) within the chamber (21) by means of the cup rotating mechanism (7).</p> |
