| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive supply device and method therefor which can ensure a uniform and high bonding thickness while maintaining the line width for preventing the flowing of an adhesive narrow. <P>SOLUTION: The adhesive supply device has a supply portion 10 for forming a bank part B by supplying an adhesive R1 to a work S1 to be bonded along the edge of the work S1, and a curing treatment portion 11 for performing treatment for curing the adhesive R1 on the outer peripheral edge of the work S1 in the adhesive R1. After an adhesive R2 is filled inside the bank part B, formed on the work S1, by the supply portion 10, works are bonded to each other at a bonding part. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
