PACKAGE ON PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a stack semiconductor package and, more particularly, to a stack semiconductor package capable of preventing the warpage phenomenon of a package on package which is vertically stacked by interposing an interposer. That is, the present invention provides the stack semiconductor package capable of preventing the warpage phenomenon and a non-wet failure phenomenon by bonding and fixing the edge part of the interposer to the edge part of a lower semiconductor package by making a bond line material permeate through a space of the mutual fusion of a stack ball for the low semiconductor package and a connection ball for the interposer and injecting the bond line material through a slot after the slot to dispense the bond line material which is the kind of an adhesive is formed on the outer side of the interposer which is stacked on the low semiconductor package.