| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding method of substrates capable of rigid bonding while suppressing warpage when a plurality of substrates are bonded. <P>SOLUTION: The bonding method of substrates includes a first underlying layer formation step for forming a first underlying layer 35a on the surface of a first substrate Sa, a second underlying layer formation step for forming a second underlying layer 35b on the surface of a second substrate Sb, a first monomer deposition step for depositing a first monomer 13a on the first underlying layer 35a formed on the surface of a first substrate Sa, a second monomer deposition step for depositing a second monomer 13b which reacts on the first monomer 13a to form a polymer on the second underlying layer 35b formed on the surface of the second substrate Sb, and a polymer formation step for bonding the first substrate Sa and the second substrate Sb by mounting the first substrate Sa and the second substrate Sb so that the surfaces, where the monomer is deposited, face each other, and bringing the first monomer 13a and the second monomer 13b into contact with each other thereby forming a polymer by reaction. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
