| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding method of substrates capable of suppressing warpage when a plurality of substrates are bonded. <P>SOLUTION: The bonding method of substrates includes a first monomer deposition step for depositing a first monomer on the surface of a first substrate, a second monomer deposition step for depositing a second monomer, which reacts on the first monomer to form a polymer, on the surface of a second substrate, and a polymer formation step for bonding the first substrate and the second substrate by mounting the first substrate and the second substrate so that the surfaces, on which the monomer is deposited, face each other, bringing the surface, on which the first monomer is deposited, and the surface, on which the second monomer is deposited, into contact with each other, and then forming a polymer by reacting the first monomer and the second monomer. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
