| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition enabling the manufacture of a surface protective film that suppresses adhesion enhancing even under an extremely high temperature environment while securing an appropriate initial adhesive force. <P>SOLUTION: The adhesive composition includes: a copolymer containing a following polymer block A and polymer block B and having a structure represented by general formula: [A-B]n (wherein, A is the polymer block A, B is the polymer block B, and n is an integer of 1 to 3) or its hydrogenated product; a copolymer having a structure represented by general formula: A-B-A or general formula [A-B]x-Y (wherein, x is an integer of 1 or more, and Y is coupling agent residue) or its hydrogenated product; and an aliphatic acid amide having an acid value of 1-7. The polymer block A is a polymer block in which an aromatic alkenyl compound unit continues and the aromatic alkenyl compound unit is mainly contained. The polymer block B is an aromatic alkenyl-conjugated diene copolymer block in which a conjugated diene unit and an aromatic alkenyl compound unit are randomly contained. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
