| 摘要 |
An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from the central region of the spin chuck to the peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in the central region of the spin chuck and a larger nozzle in the peripheral region of the spin chuck. In the method according to the invention, heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions. |
