THERMOELECTRIC MODULES CONSISTING OF THERMAL-VIA ELECTRODES AND FABRICATION METHOD THEREOF

摘要

The present invention relates to a thermoelectric module, and more specifically, to a thermoelectric module which transmits heat from a heat source to a thermoelement and emits heat from the thermoelement to a heat sink through a thermal-via electrode by forming the thermoelectric module by having the thermal-via electrode in both or either upper substrate or lower substrate of the thermoelectric module and binding p-type thermoelements and n-type thermoelements to the thermal-via electrode, and uses the thermal-via electrode as an electrode for connecting the p-type thermoelements and the n-type thermoelements, and to a fabrication method thereof.