发明名称 導電性粒子、異方性導電材料及び接続構造体
摘要 <p><P>PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conductivity, and further, lowering a connection resistance value between electrodes in case the same is used for connecting electrodes. <P>SOLUTION: The conductive particle 1 has a base material particle 2 and a conductive layer 4 formed on a surface 2a of the base material particle 2, and the conductive layer 4 contains nickel and bismuth, and a ratio of bismuth to a total of nickel and bismuth is within a range of 300-2,000μg/g. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5753646(B2) 申请公布日期 2015.07.22
申请号 JP20080250509 申请日期 2008.09.29
申请人 发明人
分类号 H01B5/00;B22F1/02;C09J9/02;C09J11/04;C09J201/00;C22C19/03;H01B1/22;H01B5/16;H01L21/60;H01R11/01 主分类号 H01B5/00
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