| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition especially suitable for use in a white prepreg to produce a white laminated plate using the prepreg and a metal-foiled white laminated plate, as well as to provide the white laminated plate and the metal-foiled white laminated plate for use in a printed wiring board for mounting a light emitting diode.SOLUTION: This thermosetting resin composition includes a polyimide resin (A), an epoxy resin (B) and a curing agent (C). The polyimide resin (A) is obtained by reacting a carboxyl group of a carboxyl group-containing polyimide resin (A1) with a monoepoxy compound (A2), and has an acid value of ≤70 KOH mg/g. The carboxyl group-containing polyimide resin (A1) is obtained by reacting an isocyanurate-typed polyisocyanate (a1), which is synthesized from an aliphatic structure-having isocyanate, with an aliphatic structure-having tricarboxylic anhydride (a2). |
