| 摘要 |
The present invention relates to an electromagnetic wave shielding film which comprises at least one layer of electromagnetic wave shielding layer. In a printed circuit board including the electromagnetic wave shielding film, the electromagnetic wave shielding film and the printed circuit board are tightly connected in a thickness direction, and a ground layer is installed on the printed circuit board. A manufacturing method of the printed circuit board comprises: 1) a step of hot pressing and hardening the electromagnetic wave shielding film and the printed circuit board in the thickness direction; and 2) a step of using a rough surface of the electromagnetic wave shielding layer to penetrate an adhesive film layer to realize grounding, or the manufacturing method of the printed circuit board may comprise: 1) a step of hot pressing and hardening the electromagnetic wave shielding film and the circuit board in the thickness direction; and 2) a step of using a conductive material to penetrate the electromagnetic wave shielding film to realize grounding, or the manufacturing method of the printed circuit board may comprise: 1) a step of hot pressing and hardening the electromagnetic wave shielding film and the circuit board in the thickness direction; 2) a step of forming a through hole or a blind hole on the circuit board; and 3) a step of metalizing the hole to realize grounding. According to the present invention, since the adhesive film layer does not contain conductive particles, costs are low. Since insertion loss is reduced, a demand for a high speed and a high frequency for an electronic product can be satisfied. |
