| 摘要 |
<p>A semiconductor device according to an embodiment includes a plurality of pads, a plurality of ESD protection circuits, each one of the ESD protection circuits being connected to a corresponding one of the plurality of pads, and an I/O circuit which is connected to a connection portion connecting output terminals of the plurality of ESD protection circuits to each other and which receives at least one input signal inputted into the plurality of pads.</p> |
