发明名称 金属張積層板
摘要 <p>Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.</p>
申请公布号 JP5751368(B2) 申请公布日期 2015.07.22
申请号 JP20140089622 申请日期 2014.04.23
申请人 发明人
分类号 B32B15/08;B29C43/18;B29C43/56;H05K1/03;H05K3/18;H05K3/42 主分类号 B32B15/08
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