发明名称 炭化珪素半導体装置の製造方法
摘要 A collector layer (101 e) having p type is formed on a silicon carbide substrate (90) having n type. A drift layer (102) having n type is formed on a top surface side of the collector layer (101e). A body region (103) provided on the drift layer (102) and having p type, and an emitter region (104) provided on the body region (103) to be separated from the drift layer (102) by the body region (103) and having n type are formed. A bottom surface side (101B) of the collector layer (101e) is exposed by removing the silicon carbide substrate (90).
申请公布号 JP5751113(B2) 申请公布日期 2015.07.22
申请号 JP20110211941 申请日期 2011.09.28
申请人 发明人
分类号 H01L29/739;H01L21/336;H01L29/12;H01L29/78 主分类号 H01L29/739
代理机构 代理人
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