| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a highly reliable metal/ceramic bonding substrate at low cost by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. <P>SOLUTION: After an active metal-containing brazing material 12 is applied onto a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied to a predetermined portion of the surface of the metal member 14 and unnecessary portions are etched, and then the resist 16 is removed. Thereafter, the unnecessary part of a metal layer 12b, which is made of a metal other than an active metal of the active metal-containing brazing material 12, is etched with a chemical to be removed. Then, while inhibiting the metal member 14 and the metal layer 12b from being etched an active metal layer 12a, which is made of the active metal of the active metal-containing brazing material 12 and a compound thereof, is selectively etched with a chemical, which selectively etches the unnecessary part of the active metal layer 12a, thereby forming a metal circuit on the ceramic substrate 10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit. <P>COPYRIGHT: (C)2010,JPO&INPIT |
