发明名称 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having high sensitivity, high resolution and excellent removing property of development scum, and to provide a cured film, a protective film, an insulating film, a semiconductor device and a display body device. <P>SOLUTION: The positive photosensitive resin composition includes an alkali-soluble resin (A), a photosensitive agent (B) and a compound (C) having a phenolic hydroxy group and an amide group in the structure of one molecule. The cured film comprises a cured product of the positive photosensitive resin composition. The semiconductor device and the display device include the cured film. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5751025(B2) 申请公布日期 2015.07.22
申请号 JP20110121973 申请日期 2011.05.31
申请人 住友ベークライト株式会社 发明人 岩井 正寛
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
代理机构 代理人
主权项
地址