发明名称 TUNABLE COMPOSITE INTERPOSER
摘要 A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.
申请公布号 EP2896069(A1) 申请公布日期 2015.07.22
申请号 EP20130765605 申请日期 2013.09.12
申请人 INVENSAS CORPORATION 发明人 WOYCHIK, CHARLES, G.;UZOH, CYPRIAN, EMEKA;SATO, HIROAKI
分类号 H01L23/498 主分类号 H01L23/498
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