发明名称 |
Tin-plated copper-alloy terminal material |
摘要 |
By forming a nickel-based coating layer or a cobalt-based coating layer having a coating thickness of 0.005 µm or larger and 0.05 µm or smaller on an outermost surface of a tin-based surface layer of a terminal material of low-insertion fore in which an asperity shape of an interface between a copper-tin alloy layer and a tin-based surface layer is controlled, it is possible to reduce insertion force of fitting even though all-purpose tin-plated terminal material is used by combination. |
申请公布号 |
EP2896724(A1) |
申请公布日期 |
2015.07.22 |
申请号 |
EP20140200007 |
申请日期 |
2014.12.23 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
INOUE, YUKI;KATO, NAOKI;NAKAYA, KIYOTAKA |
分类号 |
C25D5/12;C23C28/02;C25D3/12;C25D3/14;C25D3/30;C25D3/38;C25D5/50;C25D7/00;H01B1/02;H01R13/03 |
主分类号 |
C25D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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