发明名称 Tin-plated copper-alloy terminal material
摘要 By forming a nickel-based coating layer or a cobalt-based coating layer having a coating thickness of 0.005 µm or larger and 0.05 µm or smaller on an outermost surface of a tin-based surface layer of a terminal material of low-insertion fore in which an asperity shape of an interface between a copper-tin alloy layer and a tin-based surface layer is controlled, it is possible to reduce insertion force of fitting even though all-purpose tin-plated terminal material is used by combination.
申请公布号 EP2896724(A1) 申请公布日期 2015.07.22
申请号 EP20140200007 申请日期 2014.12.23
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 INOUE, YUKI;KATO, NAOKI;NAKAYA, KIYOTAKA
分类号 C25D5/12;C23C28/02;C25D3/12;C25D3/14;C25D3/30;C25D3/38;C25D5/50;C25D7/00;H01B1/02;H01R13/03 主分类号 C25D5/12
代理机构 代理人
主权项
地址