| 发明名称 |
Cooling system for electronics |
| 摘要 |
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus. |
| 申请公布号 |
US9089076(B2) |
申请公布日期 |
2015.07.21 |
| 申请号 |
US201213543089 |
申请日期 |
2012.07.06 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Cox Aaron R.;Grady, IV William J.;Kamath Vinod;Matteson Jason A.;Minyard Jason E. |
| 分类号 |
H05K7/20;G06F1/20;F28D15/04 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
Bowman Nicholas D.;Butler Bryan W. |
| 主权项 |
1. An apparatus for conveying heat away from an electronic component, comprising:
a first conformable thermal interface element configured to be positioned in heat conducting contact with a first electronic component in an installed position, an integral surface of the first conformable thermal interface element conformable about a surface of the first electronic component; a first heat conducting member disposed within the first conformable thermal interface element; and a manifold coupled to and in heat conducting contact with the first heat conducting member. |
| 地址 |
Armonk NY US |
