发明名称 |
Tantalum sputtering target |
摘要 |
Provided is a tantalum sputtering target, in which 1 mass ppm or more and 50 mass ppm or less of boron is contained as an essential component, and of which the purity excluding boron and gas components is 99.998% or higher. Thereby obtained is a high-purity tantalum sputtering target having a uniform and fine structure and enabling plasma stabilization and achievement of superior film evenness (uniformity). |
申请公布号 |
US9085819(B2) |
申请公布日期 |
2015.07.21 |
申请号 |
US201113805946 |
申请日期 |
2011.07.21 |
申请人 |
JX Nippon Mining & Metals Corporation |
发明人 |
Senda Shinichiro;Fukushima Atsushi |
分类号 |
C23C14/34;C22C1/02;C22C27/02;C22F1/18 |
主分类号 |
C23C14/34 |
代理机构 |
Howson & Howson LLP |
代理人 |
Howson & Howson LLP |
主权项 |
1. A tantalum sputtering target, consisting of 1 mass ppm or more and 50 mass ppm or less of boron and tantalum of a purity, excluding boron and gas components, of 99.998% or higher. |
地址 |
Tokyo JP |