Vibrating device, method for manufacturing vibrating device, and electronic apparatus

摘要

A sensor device includes a substrate, an IC chip, a sensor element, bonding wires, and a lid. The substrate includes a plurality of metal posts which are disposed so as to be electrically independent of each other and an insulator which is filled in a gap between faces different from first faces and second faces of the plurality of metal posts and integrally fixes the plurality of metal posts. The IC chip has electrode pads on an active face and is fixed to a first metal post. The sensor element has vibrating portions and is supported by the IC chip by bonding a supporting portion to the active face of the IC chip. The bonding wires electrically connect the electrode pads with second metal posts. The lid is disposed so as to cover the IC chip and the sensor element.

主权项

1. A vibrating device comprising:
a substrate including a plurality of metal posts and an insulator, the plurality of metal posts each having a first face and a second face opposite the first face, the plurality of metal posts including a first metal post and a second metal post, the insulator being filled in a gap between faces of the plurality of metal posts and integrally fixing the plurality of metal posts, the faces being different from the first face and the second face; a semiconductor circuit element having an electrode on a third face and fixed to the first metal post with a fourth face facing the first face of the first metal post, the fourth face being opposite the third face; a vibrating reed having a supporting portion and a vibrating portion extended from the supporting portion, the vibrating reed being supported by the semiconductor circuit element by bonding the supporting portion to the third face of the semiconductor circuit element; a conductive member electrically connecting the electrode with the second metal post; and a lid disposed so as to cover the semiconductor circuit element and the vibrating reed.