| 发明名称 | Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission | ||
| 摘要 | A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board. | ||
| 申请公布号 | US9088352(B2) | 申请公布日期 | 2015.07.21 |
| 申请号 | US201314045062 | 申请日期 | 2013.10.03 |
| 申请人 | SONY CORPORATION | 发明人 | Kawamura Hirofumi;Okada Yasuhiro |
| 分类号 | H04B5/00;H04B10/00;G01S7/03;H01Q9/04;G01S13/93 | 主分类号 | H04B5/00 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. A transmission device comprising: a first signal processing board for processing a millimeter wave signal; a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor, wherein, the member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the second signal processing board. | ||
| 地址 | Tokyo JP | ||