Bundle of long thin carbon structures, manufacturing method therefor, and electronic device

摘要

In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.

主权项

1. A method for manufacturing a bundle of a plurality of carbon nanotubes, comprising:
by chemical vapor deposition, fixing a first group of end parts opposite to a second group of free grown end parts of the plurality of carbon nanotubes onto a substrate; and further growing, by chemical vapor deposition, the free grown end parts of said second group to chemically bond the free grown end parts directly with each other so as to form, from said second group of free grown end groups, a flat graphite wherein the free grown end parts are chemically bonded, while the free grown end parts of said second group are growing by the chemical vapor deposition.