发明名称 |
Liquid submersion cooled electronic system |
摘要 |
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. |
申请公布号 |
US9086859(B2) |
申请公布日期 |
2015.07.21 |
申请号 |
US201213688832 |
申请日期 |
2012.11.29 |
申请人 |
LIQUIDCOOL SOLUTIONS, INC. |
发明人 |
Attlesey Chad D. |
分类号 |
H05K5/00;H05K7/00;G06F1/16;G06F1/20;H01L23/473;H05K7/20;F28D1/02;F28D15/02;F28F9/007 |
主分类号 |
H05K5/00 |
代理机构 |
Hamre, Schumann, Mueller & Larson, P.C. |
代理人 |
Hamre, Schumann, Mueller & Larson, P.C. |
主权项 |
1. An electronic device comprising:
a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior space; a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices; a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of manifold outlets; and a tube having one end connected to one of the manifold outlets and a second end closely adjacent to one of the heat generating electronic devices to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the one heat generating electronic device. |
地址 |
Rochester MN US |