发明名称 Liquid submersion cooled electronic system
摘要 A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
申请公布号 US9086859(B2) 申请公布日期 2015.07.21
申请号 US201213688832 申请日期 2012.11.29
申请人 LIQUIDCOOL SOLUTIONS, INC. 发明人 Attlesey Chad D.
分类号 H05K5/00;H05K7/00;G06F1/16;G06F1/20;H01L23/473;H05K7/20;F28D1/02;F28D15/02;F28F9/007 主分类号 H05K5/00
代理机构 Hamre, Schumann, Mueller & Larson, P.C. 代理人 Hamre, Schumann, Mueller & Larson, P.C.
主权项 1. An electronic device comprising: a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior space; a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices; a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of manifold outlets; and a tube having one end connected to one of the manifold outlets and a second end closely adjacent to one of the heat generating electronic devices to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the one heat generating electronic device.
地址 Rochester MN US
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