| 发明名称 | Method and system for manufacturing semiconductor device | ||
| 摘要 | A method for manufacturing a semiconductor device is provided. The method contains steps of providing the semiconductor device including a working area; directing a medium flow onto the working area; configuring a lens in contact with the medium flow; and directing a laser beam to the working area through the lens and the medium flow. A laser processing for manufacturing a semiconductor device is also provided. | ||
| 申请公布号 | US9085049(B2) | 申请公布日期 | 2015.07.21 |
| 申请号 | US201213691561 | 申请日期 | 2012.11.30 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hwang Chien-Ling;Jang Bor-Ping;Hsiao Yi-Li;Liao Hsin-Hung;Liu Chung-Shi |
| 分类号 | B23K26/14;B23K26/36;B23K26/38;H01L21/78;B23K26/40;H01L21/30;H01L21/26 | 主分类号 | B23K26/14 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A laser processing system for manufacturing a semiconductor device including a working area, comprising: a laser beam outlet providing therethrough a laser beam to the working area; and a medium providing device including a first passage, a second passage and a bridging part connected therebetween for providing a medium onto the working area via the first passage and collecting the medium from the working area via the second passage to form a medium flow on the working area, wherein the bridging part is connected with the laser beam outlet. | ||
| 地址 | Hsinchu TW | ||