Semiconductor device

摘要

Provided are a semiconductor device and a fabricating method of the semiconductor device. The semiconductor device may include an interlayer dielectric film formed on a substrate and including a trench, a gate insulating film formed in the trench, a first work function control film formed on the gate insulating film of the trench along bottom and sidewalls of the trench, a first metal gate pattern formed on the first work function control film of the trench and filling a portion of the trench, and a second metal gate pattern formed on the first metal gate pattern of the trench, the second metal gate pattern different from the first metal gate pattern.

主权项

1. A semiconductor device comprising:
an interlayer dielectric film formed on an upper surface of a substrate, the interlayer dielectric film including a trench; a gate insulating film formed in the trench; a work function control film formed on the gate insulating film of the trench along bottom and sidewalls of the trench; a first metal gate pattern on the work function control film of the trench and filling a portion of the trench; a second metal gate pattern on the first metal gate pattern of the trench, the second metal gate pattern different from the first metal gate pattern; and an adhesive film disposed between the second metal gate pattern and the work function control film and between the second metal gate pattern and the first metal gate pattern, wherein a distance from the upper surface of the substrate to an uppermost surface of the second metal gate pattern is greater than a distance from the upper surface of the substrate to an uppermost surface of the first metal gate pattern.