| 发明名称 | Semiconductor package and method of manufacturing the same | ||
| 摘要 | Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | ||
| 申请公布号 | US9087837(B2) | 申请公布日期 | 2015.07.21 |
| 申请号 | US201213572833 | 申请日期 | 2012.08.13 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Lee Doo Hwan;Jeong Tae Sung;Chung Yul Kyo |
| 分类号 | H01L23/28;H01L21/52;H01L23/00;H01L23/31;H01L21/56;H01L23/538;H01L21/768;H01L23/544;H01L21/54;H01L21/78 | 主分类号 | H01L23/28 |
| 代理机构 | Ladas & Parry, LLP | 代理人 | Ladas & Parry, LLP |
| 主权项 | 1. A semiconductor package, comprising: a molding member having a cavity; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings, wherein the molding member is formed as Epoxy Molding Compound, and the insulating member formed in a space between the device and the cavity, the insulting member formed on an upper part of the molding member and the insulating member formed on an upper part of the device are integrally formed. | ||
| 地址 | Gyunggi-Do KR | ||