Solid-state imaging device and electronic equipment

摘要

A solid-state imaging device includes a pixel unit in which a plurality of pixels converting physical quantities into electric signals are arranged in a two-dimensional shape, a vertical signal line for reading signals from the pixels, and column circuits arranged corresponding to columns of the pixel unit and collecting the signals from the vertical signal line at the inside of the pixel unit.

主权项

1. A solid-state imaging device comprising:
a first substrate including a pixel unit comprising a plurality of pixels configured to convert physical quantities into electric signals, the pixels arranged in a two-dimensional shape; a vertical signal line configured to read signals from the pixels; and a second substrate including column circuits respectively arranged corresponding to columns of the pixel unit and configured to collect the signals from the vertical signal line at a location within the pixel unit in a vertical direction of the column circuits, the vertical direction being parallel to the vertical signal line, wherein the first substrate and the second substrate are laminated and electrically connected to each other through a connection portion.