发明名称 |
Method and apparatus for substrate support with multi-zone heating |
摘要 |
Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber. |
申请公布号 |
US9089007(B2) |
申请公布日期 |
2015.07.21 |
申请号 |
US201313766885 |
申请日期 |
2013.02.14 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Yang Yao-Hung;Oh Jeonghoon;Hooshdaran Frank F.;Cho Tom K.;Hou Tao |
分类号 |
H05B3/10;H05B3/12;H01L21/67;H05B1/02;F26B19/00 |
主分类号 |
H05B3/10 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A substrate support assembly in a substrate process chamber, comprising:
a support member comprising a substrate support surface; and a heating element comprising two or more heating element sections; wherein the heating element sections are connected together in one electrical loop, and wherein each heating element section responds independently and differently to an input power of a power source connected to the heating element. |
地址 |
Santa Clara CA US |