发明名称 Method and apparatus for substrate support with multi-zone heating
摘要 Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.
申请公布号 US9089007(B2) 申请公布日期 2015.07.21
申请号 US201313766885 申请日期 2013.02.14
申请人 APPLIED MATERIALS, INC. 发明人 Yang Yao-Hung;Oh Jeonghoon;Hooshdaran Frank F.;Cho Tom K.;Hou Tao
分类号 H05B3/10;H05B3/12;H01L21/67;H05B1/02;F26B19/00 主分类号 H05B3/10
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A substrate support assembly in a substrate process chamber, comprising: a support member comprising a substrate support surface; and a heating element comprising two or more heating element sections; wherein the heating element sections are connected together in one electrical loop, and wherein each heating element section responds independently and differently to an input power of a power source connected to the heating element.
地址 Santa Clara CA US
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