Semiconductor device with resin mold

摘要

An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

主权项

1. An electronic device comprising;
a ceramic substrate having a first surface and a second surface opposite to the first surface; an electronic element mounted on the first surface; and a resin mold that seals the first surface of the ceramic substrate and seals the second surface of the ceramic substrate so as to expose an inner portion of the second surface, wherein the first surface has an outer edge, and the second surface has an outer edge, wherein the resin mold sandwiches the outer edge of the first surface and the outer edge of the second surface, wherein an exposed inner portion of the second surface includes a part which includes all of the second surface that is opposite to the electronic element, and wherein all of the part opposite to the electronic element is exposed from the resin mold.