Treatment of a self-assembled monolayer on a dielectric layer for improved epoxy adhesion

摘要

This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.

主权项

1. A method comprising:
providing a dielectric layer on a surface of a substrate, over an electromechanical systems device disposed on the substrate; forming a self-assembled monolayer on the dielectric layer; selectively treating a seal region of the self-assembled monolayer; and bonding a component to the seal region of the self-assembled monolayer with an epoxy.