Photocurable adhesive composition, module apparatus using the same, and method of assembling a module

摘要

A photocurable adhesive composition, a module apparatus, and a method of assembling a module, the composition including a urethane (meth)acrylate binder, the composition having a viscosity of about 3,000 to about 6,000 cps at 25° C., and providing an adhesive film having an adhesive strength of about 30 N/cm2 or more.

主权项

1. A photocurable adhesive composition, comprising:
a urethane (meth)acrylate binder; a photocurable monomer; a photoinitiator; and an adhesion enhancing monomer, the composition having a viscosity of about 3,000 to about 6,000 cps at 25° C., the composition providing an adhesive film having an adhesive strength to glass of about 30 N/cm2 to about 50 N/cm2 after curing, wherein the adhesive strength is measured between a glass substrate and a polycarbonate film, the composition having a storage modulus of about 2,000 to about 6,000 Pa at 25° C., the adhesion enhancing monomer including at least one selected from the group of acryloyl morpholine, 2-hydroxyethyl(meth)acrylate phosphate, phosphated epoxy (meth)acrylate, 2-methyl-2-phosphonooxyethyl ester, and tetrahydrofurfuryl (meth)acrylate, and the photocurable monomer including a hydroxyl group containing (meth)acrylic acid ester, a C4 to C20 alicyclic ring containing (meth)acrylic acid ester, and a carboxyl group containing vinyl monomer.